Quality
tests for Printed Circuits Boards
The Printed
Circuit Boards (PCBs) are very sophisticated and complicated items which are of
utmost importance in the smooth operation and sustainability of the electronic
machinery and it would not be an overstatement to say that even the slightest
of faults in a PCB can bring the working of fundamental machinery to a
standstill. In this scenario, it is of vital to have approved standards of
quality control for the manufacturing, development and operation of the Printed
Circuit Boards (PCBs). Some of the standard tests performed in order to ensure
the quality of the Printed Circuit Boards (PCBs) are as follows,
1)
100%
Electrical Test
3)
Dimensional
Inspection
4)
Micro
Section
5)
Solder
Ability Test (245+-5C) , 10 sec
6)
Thermal
Test (288+-5C)
7)
Tape Test
8)
Peel Test
9)
Impedance
Test
10) Ionic Contamination Test
1)
100%
Electrical Test
Electrical
testing is of utmost importance for a PCB which involves the electrical testing
of various aspects of the Printed Circuit Boards (PCBs). In electrical testing
every “Node” on the PCB board is tested. Short circuit tests are performed to
be if any part of the PCB is short circuited. Clam shell tests are performed to
obtain the simultaneous testing of both sides of the PCB in case of double
sided Printed Circuit Boards (PCBs). Continuity tests are performed to check if
the resistance between the tests points is within specified limit. Some of the other tests performed in
Electrical testing of the Printed Circuit Boards (PCBs) are flip test, high pot
test, impedance control test, leakage test, opens test and optimized net list
tests.
2)
100% Visual
Inspection
Visual
tests are performed using AOI machines to check if all the components after the
Printed Circuit Boards (PCBs) assembly process are there where they are
supposed to be. The AOI machines use high resolution cameras aided with
software Gerber and drill files to make the comparison on the Printed Circuit
Boards (PCBs).
3)
Dimensional
Inspection
Dimensional
inspection is necessary because the size and dimension of the Printed Circuit
Boards (PCBs) is specified as per the design of the device in which the PCB has
to be used in. The dimensional test compares the physical dimensions of the PCB
against the software provided design of the PCB.
The micro
testing of the Printed Circuit Boards (PCBs) is performed in order to check the
drill via on the PCB. Via are micro sized in PCB and have to be carved with
greatest care as slight offset in via can be of serious design and operation
faults.
5)
Solder
Ability Test
It is our
understanding that components are soldered on the PCB during the Printed
Circuit Boards (PCBs) assembly process therefore it is necessary to check the
durability of the solder through the solder ability test. The solder has to
withstand high temperatures and extreme working conditions without showing any
signs of deterioration. The solder tests are performed up to 245C for 3 seconds
to check the response of the solder. If the able to withstand such conditions,
only then it passes the solder ability test.
During the
working of Printed Circuit Boards (PCBs), extreme conditions can arise which
can lead to heating of the inner core. In such cases, the Printed Circuit
Boards (PCBs) should be able to withstand the extreme heating. Thermal ability
tests are performed by subjecting it to temperatures up to 288 for about 10
seconds to check its performance.
Tape tests
are performed to check the adherence of the copper foil on the PCB. The tape is
applied to the Printed Circuit Boards (PCBs) and peeled off in order to check
if any copper foil residue adhered to the tape. The Printed Circuit Boards
(PCBs) is only passed for further processing if no copper residue adheres to
the tape.
8)
Impedance
Test
Impedance
testing is done in order to check the impedance between different nodes and the
components of the Printed Circuit Boards (PCBs). The impedance should not be
offset to the specified limits.
9)
Ionic
Contamination Test
The Printed
Circuit Boards (PCBs) during manufacturing and developing process can be
contaminated with ionic impurities which can lead to the decrease in the
impedance of the Printed Circuit Boards (PCBs) which can cause operational
ambiguities. In order to avoid any unforeseen circumstances, the ionic
contamination tests are performed.